Call for Papers: Deadline Submission Contact Adriana Rangel
Contact Adriana Rangel adromero@cisco.com
Activities
Presentations
6 x four hour short courses from thermal thought leaders
Thermal conference with 50+ technical papers & how-to’s from leading companies and universities
Numerous FREE tear down sessions and product workshops for all attendees
Exhibits
40+ companies set up to show off their capabilities
Technical sales engineers who are ready to introduce and demonstrate new technology in our exhibition hall.
Booth size of 10 x 8 ft. Interact with – and gain – new customers and clients
Attendees
Over 400 engineers, academicians & industry pundits from 20 countries
150+ companies, consultants and universities represented
FREE admission to all for exhibits, vendor workshops, how-to courses, and products tear downs
“I’ve been involved with SEMI-THERM for over 10 years now. It is one of the best events to connect with colleagues, meet new friends and to learn from industry veterans.”
George Meyer, CEO, Celsia Inc.
Total Activity Time
Who Should Attend
Attendees include anyone interested in thermal design, management and characterization of electronic systems and components. SEMI-THERM provides a forum for engineers, academics, and executives to learn, exchange ideas, and display the latest in thermal management techniques, products and services. Here are some of the topics we’ve covered in past years:
New Technologies
- Advances in Thermal Components
- Energy Harvesting Materials
- Thermal Control Methods
- 3D & Nano-Technologies
Component & System Design
- Heat Spreaders, Air Movers, TIMs
- Design Software & Modeling
- Processors, ICs, Memory
- Solid State Technologies
Testing & Validation
- Characterization & Material Measurement
- Instrumentation & Controls
- Reliability Testing
- JEDEC Standards
Applications
- Portable & Power Electronics
- Harsh Environments
- Telecommunications
- Data Centers
Topic Champions
| SESSION TITLE | TOPIC CHAMPION |
|---|---|
| Advanced Cooling Techniques/Technology | |
| Air Mover Technologies with Low Acoustics | |
| Characterization and Standardization of Material Property Measurements | |
| Component to System Level Thermal Management | |
| Computational Fluid Dynamics (CFD) | |
| Energy Harvesting Materials Thermo Electronics | |
| Mechanical Modeling, Simulations and Characterization | |
| Multi-Physics Based Reliability, including Accelerated Testing | |
| Multi-Physics Modeling and Characterization of Products and Processes | |
| Nanotechnology & Novel Materials | |
| Packaging Materials | |
| Roadmaps, Specifications and Traditional Cooling Limits |