SEMI-THERM 33 Scholarship Winners
K. Mulay Memorial Scholarship ($1,500)
for Best Student Paper at ST33
Experimental Study on Flow Boiling in a Hierarchial Manifold Microchannel Heat Sink Array
Kevin P Drummond, Purdue University
Celsia Inc. Scholarship ($1,000)
for Best Student Paper
in the area of Two-Phase Thermal Management at ST33
Experimental Study on Flow Boiling in a Hierarchial Manifold Microchannel Heat Sink Array
Kevin P Drummond, Purdue University
Thermal Engineering Associates, Inc. Scholarship ($1,000)
for Best Student Paper
in the area of Thermal Measurement Technology at ST33
Experiments on the Thermal Resistance of Deformable Thermal Interface Materials under Mechanical Loading
Richard Kenney, Villanova University
Center for Energy-Smart Electronic Systems Scholarship ($1,000)
for Best Student Paper
in the area of Energy-Smart Electronic Systems Technology at ST33
Impact of Elevated Temperature on Data center Operation based on Internal and External Instrumentation
Mohammad I. Tradat, Binghamton University
To be eligible, candidates must:
- Be senior undergraduate or graduate students at a recognized university
- Part of a significant contributor on an academic or industry team
- Be the first or second student author of the technical paper
- Be the paper presenter at SEMI-THERM
Paper submissions must go through SEMI-THERM’s peer review process. Scholarship award selection will be based on:
- Originality of the reported activity
- Technical proficiency demonstrated in the paper and the presentation
- Contribution to contemporary electronics thermal management body of knowledge
The final selection decision will be made by the paper selection committee, including a representative of the scholarship sponsor.
SEMI-THERM reserves the right to not award the specific area scholarships if
- There are less than three student-submitted papers in the topic area, and
- No student-submitted paper meets the criteria described above
Scholarship awards will be sent to each selectee within 15 days after SEMI-THERM.